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SC561 Fiches technique(PDF) 13 Page - Semtech Corporation |
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SC561 Fiches technique(HTML) 13 Page - Semtech Corporation |
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13 / 15 page ![]() SC561 13 Layout Considerations While layout for linear devices is generally not as critical as for a switching application, careful attention to detail will ensure reliable operation. The diagram below illus- trates proper layout of a circuit. Attach the part to a large copper footprint, to enable better heat transfer from the device on PCBs where there are internal power and ground planes. • Applications Information (continued) Place the input, output, and bypass capacitors close to the device for optimal transient response and device behavior. Connect all ground connections directly to the ground plane whenever possible to minimize ground potential differences on the PCB. • • Scale = 20:1 (20mm = 1mm) Layer 1 Layer 2 Via between Layer 1 and Layer 2 SC561 CIN COUTB COUTA CBYP |
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