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TLRME28C Fiches technique(PDF) 2 Page - Toshiba Semiconductor |
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TLRME28C Fiches technique(HTML) 2 Page - Toshiba Semiconductor |
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2 / 9 page ![]() TL(RE,RME,SE,OE,YE,GE)28C(F) 2007-10-01 2 Electrical and Optical Characteristics (Ta = 25°C) Typ. Emission Wavelength Luminous Intensity IV Forward Voltage VF Reverse Current IR Product Name λd λP Δλ IF Min Typ. IF Typ. Max IF Max VR TLRE28C(F) 630 (644) 20 20 85 200 20 1.9 2.4 20 50 4 TLRME28C(F) 626 (636) 23 20 85 200 20 1.9 2.4 20 50 4 TLSE28C(F) 613 (623) 20 20 85 300 20 1.9 2.4 20 50 4 TLOE28C(F) 605 (612) 20 20 153 500 20 2.0 2.4 20 50 4 TLYE28C(F) 587 (590) 17 20 153 350 20 2.0 2.4 20 50 4 TLGE28C(F) 571 (574) 17 20 47.6 150 20 2.0 2.4 20 50 4 Unit nm mA mcd mA V mA μA V Please be careful of the following: • Soldering temperature: 260°C max, soldering time: 3 s max (soldering portion of lead: below the lead stopper of the device) • If the lead is formed, the lead should be formed up to below the lead stopper of the device without forming stress to the resin. Soldering should be performed after lead forming. • This visible LED lamp also emits some IR light. If a photodetector is located near the LED lamp, please ensure that it will not be affected by this IR light. |
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