ADPL42002ACPZN1.8-R7 datasheet(20/22 Pages) AD

20 / 22 page

Data Sheet

ADPL42002

analog.com

Rev. 1

20 of 22

OUTLINE DIMENSIONS

Figure 35. 6-Lead Frame Chip Scale Package [LFCSP] 2mm x 2mm Body

and 0.55mm Package Height (CP-6-3) Dimensions shown in millimeters

Figure 36. 8-Lead Standard Small Outline Package, with Exposed Pad [SOIC_N_EP]

Narrow Body (RD-8-1) Dimensions shown in millimeters

1.70

1.60

1.50

0.425

0.350

0.275

TOP VIEW

0.35

0.30

0.25

BOTTOM VIE W

PIN 1 INDEX

AREA

0.60

0.55

0.50

1.10

1.00

0.90

0.20 REF

0.05 MAX

0.02 NOM

0.65 BSC

EXPOSED

PAD

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

2.10

2.00 SQ

1.90

0.15 MIN

SEATING

PLANE

PIN1

INDIC ATORAREAOPTIONS

(SEEDETAILA)

DETAIL A

(JEDEC 95)

TOP VIEW

SIDE VIEW

COMPLIANT TO JEDEC STANDARDS MS-012-AA

0.356

0.457

4.00

3.90

3.80

6.20

6.00

5.80

5.00

4.90

4.80

0.10 MAX

0.05 NOM

3.81 REF

8°

0°

45°

1.04 REF

1.75

1.35

1.65

1.25

2.39

2.29 SQ

2.19

0.51

0.31

0.50

0.25

1.27

0.40

0.25

0.17

COPLANARITY

0.10

1.27

BSC

BOTTOM VIEW

END VIEW

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

SEATING

PLANE

EXPOSED

PAD

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