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33982 Fiches technique(PDF) 29 Page - Freescale Semiconductor, Inc |
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33982 Fiches technique(HTML) 29 Page - Freescale Semiconductor, Inc |
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29 / 37 page ![]() Analog Integrated Circuit Device Data Freescale Semiconductor 29 33982 PACKAGING SOLDERING INFORMATION PACKAGING SOLDERING INFORMATION SOLDERING INFORMATION The 33982 is packaged in a surface mount power package (PQFN), intended to be soldered directly on the printed circuit board. The AN2467 provides guidelines for Printed Circuit Board design and assembly. PACKAGE DIMENSIONS For the most current revision of the package, visit www.freescale.com and perform a keyword search on 98ARL10596D. Dimensions shown are provided for reference ONLY. |
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