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ADP151 Fiches technique(PDF) 18 Page - Analog Devices |
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ADP151 Fiches technique(HTML) 18 Page - Analog Devices |
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18 / 23 page ![]() Data Sheet ADP151 APPLICATIONS INFORMATION analog.com Rev. J | 18 of 23 Figure 51. LFCSP 500 mm2 of PCB Copper, TA = 25°C Figure 52. LFCSP 100 mm2 of PCB Copper, TA = 25°C Figure 53. LFCSP 50 mm2 of PCB Copper, TA = 25°C Figure 54. LFCSP 500 mm2 of PCB Copper, TA = 50°C Figure 55. LFCSP 100 mm2 of PCB Copper, TA = 50°C Figure 56. LFCSP 50 mm2 of PCB Copper, TA = 50°C In the case where the board temperature is known, use the thermal characterization parameter (ΨJB) to estimate the junction tempera- ture rise (see Figure 57 and Figure 58). Maximum TJ is calculated from the TB and PD using the following formula: |
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