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STV7622BMP Fiches technique(PDF) 31 Page - STMicroelectronics |
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STV7622BMP Fiches technique(HTML) 31 Page - STMicroelectronics |
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31 / 32 page ![]() STV7622 Tested wafer disclaimer 31/32 12 Tested wafer disclaimer All wafers are tested and guaranteed to comply with this specification until the wafer sawing stage, for a period of ninety (90) days from the delivery date. Please remember that it is the customer’s responsibility to test and qualify their application using the STMicroelectronics die. STMicroelectronics is ready to support customers when qualifying the product. 13 Ordering information 14 Revision history Table 14. Order codes Part number Description STV7622/BMP Tested and usawn bump wafer (u = die) Table 15. Document revision history Date Revision Changes 29-May-2007 1 Initial release |
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