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STPS2150 Fiches technique(PDF) 5 Page - STMicroelectronics |
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STPS2150 Fiches technique(HTML) 5 Page - STMicroelectronics |
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5 / 7 page ![]() STPS2150 Package information 5/7 2 Package information Band shows cathode. Epoxy meets UL94, V0. Figure 15. SMA Foot Print Dimensions (in mm) In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 4. SMA Package dimensions REF. DIMENSIONS Millimeters Inches Min. Max. Min. Max. A1 1.90 2.03 0.075 0.080 A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.41 0.006 0.016 E 4.80 5.60 0.189 0.220 E1 3.95 4.60 0.156 0.181 D 2.25 2.95 0.089 0.116 L 0.75 1.60 0.030 0.063 Table 5. DO-15 Package dimensions REF. DIMENSIONS Millimeters Inches Min. Max. Min. Max. A 6.05 6.75 0.238 0.266 B 2.95 3.53 0.116 0.139 C 26 31 1.024 1.220 D 0.71 0.88 0.028 0.035 E C L E1 D A1 A2 b 1.75 5.49 1.87 1.67 1.87 A C C D B |
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