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MPX4100ASX Fiches technique(PDF) 6 Page - Freescale Semiconductor, Inc |
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MPX4100ASX Fiches technique(HTML) 6 Page - Freescale Semiconductor, Inc |
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6 / 10 page ![]() PACKAGE DIMENSIONS CASE 867-08 ISSUE N BASIC ELEMENT (A, D) CASE 867-O8 ISSUE N BASIC ELEMENT PIN 1 F G N L R 12 34 5 6 6 PL D SEATING PLANE -T- M A M 0.136 (0.005) T POSITIVE PRESSURE (P1) C B M J S -A- STYLE 1: PIN 1. VOUT 2. GROUND 3. VCC 4. V1 5. V2 6. VEX STYLE 3: PIN 1. OPEN 2. GROUND 3. +VOUT 4. +VSUPPLY 5. -VOUT 6. OPEN STYLE 2: PIN 1. OPEN 2. GROUND 3. -VOUT 4. VSUPPLY 5. +VOUT 6. OPEN MAX MILLIMETERS INCHES 16.00 13.56 5.59 0.84 1.63 0.100 BSC 2.54 BSC 0.40 18.42 30˚ NOM 30˚ NOM 12.57 11.43 DIM A B C D F G J L M N R S MIN 0.595 0.514 0.200 0.027 0.048 0.014 0.695 0.475 0.430 0.090 MAX 0.630 0.534 0.220 0.033 0.064 0.016 0.725 0.495 0.450 0.105 MIN 15.11 13.06 5.08 0.68 1.22 0.36 17.65 12.07 10.92 2.29 2.66 NOTES: 1. 2. 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). MPX4100 Sensors 6 Freescale Semiconductor |
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