KING BILLION ELECTRONICS CO., LTD

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HE83149

HE80000 SERIES

9

V1.0E

I. Important Note

1. Please always take in mind that ICE is different from IC which is your target body. ICE is the

whole set of HE80000 series IC, but each IC is a subset of ICE. Never use any hardware resource

that your target IC didn't have these resources, especially RAM and register. KBIDS and compiler

cannot prevent user to use some hardware resources that don’t exist in your target IC. Please

check the following table and refer to the abbreviation in HE80000 user's manual.

I.F.C. E.S.C. I.P.R PROM DROM

TP TP+1 RAM

PP

DP

I/O

DTMF WDT

◎

◎

◎

64KB

192KB 18-bit ◎

512B

3-bit

8-bit

8~24

—

◎

Timer

VO DAO OP PWM

LCD

Type

COM*SEG

Bias

T1,T2,TB

◎

—

—

◎

1024~768

I

16*64

1/5

2. To access any address larger than 64KB, users must update TPP first, TPH, and then TPL. Only

follow this order, the pre-charge circuit of ROM will work correctly. 5us waiting is necessary

before LDV instruction is executed since Data ROM is a low speed ROM. Users can not emulate

this accessing process in ICE. So 5us delay should be added by firmware.

3. LCD driving circuit must be turn off before IC goes into sleep mode.

4. Please bonds the TSTP_P, RSTP_N and PRTD [7:0] with test points on PCB (can be soldered and

probed) as you can, then some testing can be performed on PCB if necessary. The TSTP_P is

suggested to connect to ground by a 0 ohm resistor. The following figure is an example (Testing

point with through hole).

5.

6. LV3 must be lower than 9.0 Volt. Otherwise IC may be breakdown.

J. Updated Record

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