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M93C86-RBN3P/W Fiches technique(PDF) 8 Page - STMicroelectronics |
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M93C86-RBN3P/W Fiches technique(HTML) 8 Page - STMicroelectronics |
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8 / 38 page ![]() Description M93C86, M93C76, M93C66, M93C56, M93C46 8/38 Figure 2. DIP, SO, TSSOP and MLP connections (top view) 1. See Package mechanical section for package dimensions, and how to identify pin-1. 2. DU = Don’t Use. The DU (do not use) pin does not contribute to the normal operation of the device. It is reserved for use by STMicroelectronics during test sequences. The pin may be left unconnected or may be connected to VCC or VSS. VSS Q ORG DU C SVCC D AI01929B M93Cx6 1 2 3 4 8 7 6 5 |
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