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M48T201V Fiches technique(PDF) 30 Page - STMicroelectronics |
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M48T201V Fiches technique(HTML) 30 Page - STMicroelectronics |
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30 / 35 page ![]() Package mechanical data M48T201Y, M48T201V 30/35 6 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 15. SOH44 – 44-lead plastic small outline, SNAPHAT, package outline Note: Drawing is not to scale. SOH-A E N D C L A1 α 1 H A CP Be A2 eB Table 15. SOH44 – 44-lead plastic small outline, SNAPHAT, pack. mech. Symb mm inches Typ Min Max Typ Min Max A 3.05 0.120 A1 0.05 0.36 0.002 0.014 A2 2.34 2.69 0.092 0.106 B 0.36 0.46 0.014 0.018 C 0.15 0.32 0.006 0.012 D 17.71 18.49 0.697 0.728 E 8.23 8.89 0.324 0.350 e 0.81 – – 0.032 – – eB 3.20 3.61 0.126 0.142 H 11.51 12.70 0.453 0.500 L 0.41 1.27 0.016 0.050 a0° 8° 0° 8° |
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