AD8317

Data Sheet

Rev. D | Page 18 of 19

DIE INFORMATION

BOND PAD STATISTICS

ALL MEASURMENTS IN MICRONS.

MINIMUM PASSIVATION OPENING: 59 × 59 MIN PAD PITCH: 89

DIE SIZE CALCULATION

ALL MEASURMENTS IN MICRONS.

DIEX (WIDTH OF DIE IN X DIRECTION) = 670

DIEY (WIDTH OF DIE IN Y DIRECTION) = 1325

DIE THICKNESS = 305 MICRONS

BALL BOND SHEAR STRENGTH SPECIFICATION: MINIMUM 15 GRAMS

1

2

2

3

4

5

6

7

8

Y

X

DB1

Figure 39. Die Outline Dimensions

Table 6. Die Pad Function Descriptions

Pad No.

X Coordinate1

Y Coordinate2

Mnemonic

Description

1

−158

+538

INHI

RF Input. Nominal input range of −50 dBm to 0 dBm, referenced to 50 Ω;

ac-coupled RF input.

2, 2

−213, −213

+436, +347

COMM

Device Common. Connect both pads to a low impedance ground plane.

3

−209

−159

CLPF

Loop Filter Capacitor. In measurement mode, this capacitor sets the pulse

response time and video bandwidth. In controller mode, the capacitance on this

node sets the response time of the error amplifier/integrator.

4

−198

−427

VSET

Setpoint Control Input for Controller Mode or Feedback Input for Measurement

Mode.

5

+209

−483

VOUT

Measurement and Controller Output. In measurement mode, VOUT provides a

decreasing linear-in dB representation of the RF input signal amplitude. In controller

mode, VOUT is used to control the gain of a VGA or VVA with a positive gain sense

(increasing voltage increases gain).

6

+198

−187

TADJ

Temperature Compensation Adjustment. Frequency-dependent temperature

compensation is set by connecting a ground-referenced resistor to this pin.

7

+206

+412

VPOS

Positive Supply Voltage: 3.0 V to 5.5 V.

8

+149

+537

INLO

RF Common for INHI. AC-coupled RF common.

DB1

−105

−543

COMM

Device Common. Connect to a low impedance ground plane.

1 Die X (width of die in X direction) = 670.

2 Die Y (width of die in Y direction) = 1325.