MCP8021 datasheet(60/66 Pages) MICROCHIP

No de pièce	MCP8021

Description	3-Phase Brushless DC (BLDC) Motor Gate Driver with Power Module, Sleep Mode, Op Amps

PDF	66 Pages

Scroll/Zoom	100%

Fabricant	MICROCHIP [Microchip Technology]

Site Internet	http://www.microchip.com

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60 / 66 page

MCP8021/2

DS20006265D-page 60

 2020-2024 Microchip Technology Inc. and its subsidiaries

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Center Pad Width

Center Pad Length

Contact Pitch

3.30

4.70

MILLIMETERS

0.50 BSC

MIN

MAX

Contact Pad Length (X38)

Contact Pad Width (X38)

1.50

0.30

Microchip Technology Drawing C04-2424A

NOM

38-Lead Thin Shrink Small Outline Package (SBX) - 4.4 mm Body [TSSOP]

Contact Pad Spacing

5.90

Thermal Via Diameter

Thermal Via Pitch

0.30

1.00

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

With 4.6x 3.2 mm Exposed Pad

SILK SCREEN

ØV

MCP8021 Fiches technique(PDF) 60 Page - Microchip Technology