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UBA2021 Fiches technique(PDF) 13 Page - NXP Semiconductors |
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UBA2021 Fiches technique(HTML) 13 Page - NXP Semiconductors |
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13 / 20 page ![]() 2001 Jan 30 13 Philips Semiconductors Product specification 630 V driver IC for CFL and TL lamps UBA2021 PACKAGE OUTLINES UNIT A max. A1 A2 A3 bp cD(1) E(1) (1) eHE LLp QZ y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.0 0.4 SOT108-1 X w M θ A A1 A2 b p D HE L p Q detail X E Z e c L v M A (A ) 3 A 7 8 1 14 y 076E06 MS-012 pin 1 index 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.35 0.34 0.16 0.15 0.050 1.05 0.041 0.244 0.228 0.028 0.024 0.028 0.012 0.01 0.25 0.01 0.004 0.039 0.016 97-05-22 99-12-27 0 2.5 5 mm scale SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 |
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