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UBA1707TS Fiches technique(PDF) 29 Page - NXP Semiconductors |
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UBA1707TS Fiches technique(HTML) 29 Page - NXP Semiconductors |
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29 / 36 page ![]() 1999 Feb 17 29 Philips Semiconductors Product specification Cordless telephone, answering machine line interface UBA1707 PACKAGE OUTLINES UNIT A max. A1 A2 A3 bp cD (1) E (1) (1) eHE LLp Q Z y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm inches 2.65 0.30 0.10 2.45 2.25 0.49 0.36 0.32 0.23 18.1 17.7 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 0 o o 0.25 0.1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.1 0.4 SOT136-1 X 14 28 w M θ A A1 A2 b p D HE L p Q detail X E Z c L v M A e 15 1 (A ) 3 A y 0.25 075E06 MS-013AE pin 1 index 0.10 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.71 0.69 0.30 0.29 0.050 1.4 0.055 0.419 0.394 0.043 0.039 0.035 0.016 0.01 0.25 0.01 0.004 0.043 0.016 0.01 0 5 10 mm scale SO28: plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 95-01-24 97-05-22 |
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