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TUSB4041IPAPRG4 Fiches technique(PDF) 42 Page - Texas Instruments |
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TUSB4041IPAPRG4 Fiches technique(HTML) 42 Page - Texas Instruments |
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42 / 48 page ![]() www.ti.com EXAMPLE STENCIL DESIGN ( 4.44) (11.4) 60X (0.5) 64X (1.5) 64X (0.3) (11.4) 3.75 X 3.75 0.178 4.06 X 4.06 0.152 4.44 X 4.44 (SHOWN) 0.127 5 X 5 0.1 SOLDER STENCIL OPENING STENCIL THICKNESS PowerPAD - 1.2 mm max height PAP0064M PLASTIC QUAD FLATPACK 4221602/A 07/2014 TM NOTES: (continued) 9. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 10. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE EXPOSED PAD 100% PRINTED SOLDER COVERAGE BY AREA SCALE:6X SEE TABLE FOR DIFFERENT OPENINGS FOR OTHER STENCIL THICKNESSES 0.127 THICK STENCIL BASED ON SYMM SYMM 64 49 17 32 33 48 1 16 BY SOLDER MASK METAL COVERED 42 TUSB4041I SLLSEK3E – JULY 2015 – REVISED SEPTEMBER 2017 www.ti.com Product Folder Links: TUSB4041I Submit Documentation Feedback Copyright © 2015–2017, Texas Instruments Incorporated |
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