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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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LEAP0MQ Fiches technique(PDF) 12 Page - OSRAM GmbH |
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LEAP0MQ Fiches technique(HTML) 12 Page - OSRAM GmbH |
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12 / 22 page  LE A P0MQ DATASHEET DATASHEET 12 | Version 1.4 | 2024-07-02 Recommended Solder Pad 7) For protection during reflow soldering and handling a foil is attached to the device. The foil has to be removed before opera- tion. For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. To ensure a high solder joint reliability and to minimize the risk of solder joint cracks, the customer is responsible to evaluate the combina- tion of PCB board and solder paste material for his application. |
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