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ADA4084-2ACPZ-R7 Fiches technique(PDF) 35 Page - Analog Devices |
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ADA4084-2ACPZ-R7 Fiches technique(HTML) 35 Page - Analog Devices |
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35 / 36 page ![]() Data Sheet ADA4084-1/ADA4084-2/ADA4084-4 Rev. I | Page 35 of 36 2.70 2.60 SQ 2.50 COMPLIANT TO JEDEC STANDARDS MO-220-WGGC. 1 0.65 BSC 16 5 8 9 12 13 4 4.10 4.00 SQ 3.90 0.45 0.40 0.35 0.80 0.75 0.70 0.05 MAX 0.02 NOM 0.20 REF 0.20 MIN COPLANARITY 0.08 PIN 1 INDICATOR 0.35 0.30 0.25 BOTTOM VIEW SEATING PLANE TOP VIEW SIDE VIEW FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. 1 PIN 1 INDIC ATOR AREA OPTIONS (SEE DETAIL A) DETAIL A (JEDEC 95) EXPOSED PAD Figure 119. 16-Lead Lead Frame Chip Scale Package [LFCSP] 4 mm × 4 mm Body and 075 mm Package Height (CP-16-17) Dimensions shown in millimeters COMPLIANT TO JEDEC STANDARDS MO-153-AB-1 8° 0° 4.50 4.40 4.30 14 8 7 1 6.40 BSC PIN 1 5.10 5.00 4.90 0.65 BSC 0.15 0.05 0.30 0.19 1.20 MAX 1.05 1.00 0.80 0.20 0.09 0.75 0.60 0.45 COPLANARITY 0.10 SEATING PLANE Figure 120. 14-Lead Thin Shrink Small Outline Package [TSSOP] (RU-14) Dimensions shown in millimeters |
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