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TDA9178 Fiches technique(PDF) 32 Page - NXP Semiconductors |
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TDA9178 Fiches technique(HTML) 32 Page - NXP Semiconductors |
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32 / 36 page ![]() 1999 Sep 24 32 Philips Semiconductors Preliminary specification YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor TDA9178 UNIT A max. A1 A2 A3 bp cD (1) E (1) (1) eHE LLp Q Z y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm inches 2.65 0.30 0.10 2.45 2.25 0.49 0.36 0.32 0.23 15.6 15.2 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 0 o o 0.25 0.1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.1 0.4 SOT137-1 X 12 24 w M θ A A1 A2 b p D HE L p Q detail X E Z c L v M A 13 (A ) 3 A y 0.25 075E05 MS-013AD pin 1 index 0.10 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.61 0.60 0.30 0.29 0.050 1.4 0.055 0.419 0.394 0.043 0.039 0.035 0.016 0.01 0.25 0.01 0.004 0.043 0.016 0.01 e 1 0 5 10 mm scale SO24: plastic small outline package; 24 leads; body width 7.5 mm SOT137-1 95-01-24 97-05-22 |
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