| Moteur de recherche de fiches techniques de composants électroniques |
|
ZXFV302EV Fiches technique(PDF) 2 Page - Zetex Semiconductors |
|
|
|||||||||||||||||||||||||||||
ZXFV302EV Fiches technique(HTML) 2 Page - Zetex Semiconductors |
|
2 / 3 page ![]() PCB design A continuous ground plane is required under the device and its signal connection paths, to provide the shortest possible ground return paths for signals and power supply filtering. A double-sided or multi-layer PCB construction is required, with plated-through via holes providing closely spaced low-inductance connections from some components to the continuous ground plane (some of these holes are not visible in the figures for the Evaluation Board – artworks and NC drill output can be provided if required). ZXFV302EV SEMICO NDUC TORS ISSUE 1 - SEPTEMBER 2004 2 Figure 2 Evaluation circuit top copper layout (overall dimensions 2.5 x 2.25 inches) Figure 3 Evaluation board bottom copper layout (viewed through from top) |
|
|
Lien URL |
| ALLDATASHEET vous a-t-il été utile ? [ DONATE ] |
À propos de Alldatasheet | Publicité | Contactez-nous | Politique de confidentialité | Lien vers la fiche technique | Echange de liens | Fabricants All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |