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AD8505ARJZ-R2 Fiches technique(PDF) 20 Page - Analog Devices |
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AD8505ARJZ-R2 Fiches technique(HTML) 20 Page - Analog Devices |
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20 / 21 page ![]() AD8505/AD8506/AD8508 Data Sheet Rev. F | Page 20 of 21 COMPLIANT TO JEDEC STANDARDS MO-153-AB-1 8° 0° 4.50 4.40 4.30 14 8 7 1 6.40 BSC PIN 1 5.10 5.00 4.90 0.65 BSC 0.15 0.05 0.30 0.19 1.20 MAX 1.05 1.00 0.80 0.20 0.09 0.75 0.60 0.45 COPLANARITY 0.10 SEATING PLANE Figure 55. 14-Lead Thin Shrink Small Outline Package [TSSOP] (RU-14) Dimensions shown in millimeters 0.340 0.320 0.300 0.380 0.355 0.330 0.270 0.240 0.210 A B C D E 1 2 3 BOTTOM VIEW (BALL SIDE UP) 2.00 BSC 1.00 BSC 0.50 BSC 0.50 BSC 0.25 BSC 0.25 BSC 0.25 BSC 0.25 BSC 0.50 BSC 0.50 BSC 0.650 0.595 0.540 1.50 1.46 1.42 3.00 2.96 2.92 TOP VIEW (BALL SIDE DOWN) END VIEW BALL A1 IDENTIFIER SEATING PLANE COPLANARITY 0.10 Figure 56. 14-Ball Wafer Level Chip Scale Package [WLCSP] (CB-14-1) Dimensions shown in millimeters |
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