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TDA8763AM/3 Fiches technique(PDF) 18 Page - NXP Semiconductors |
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TDA8763AM/3 Fiches technique(HTML) 18 Page - NXP Semiconductors |
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18 / 24 page ![]() 1999 Jan 06 18 Philips Semiconductors Product specification 10-bit high-speed low-power ADC TDA8763A PACKAGE OUTLINE UNIT A1 A2 A3 bp cD(1) E(1) (1) eHE LLp QZ y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm 0.21 0.05 1.80 1.65 0.38 0.25 0.20 0.09 10.4 10.0 5.4 5.2 0.65 1.25 7.9 7.6 0.9 0.7 1.1 0.7 8 0 o o 0.13 0.1 0.2 DIMENSIONS (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. 1.03 0.63 SOT341-1 MO-150AH 93-09-08 95-02-04 X w M θ A A1 A2 b p D HE L p Q detail X E Z e c L v M A (A ) 3 A 114 28 15 0.25 y pin 1 index 0 2.5 5 mm scale SSOP28: plastic shrink small outline package; 28 leads; body width 5.3 mm SOT341-1 A max. 2.0 |
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