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TDA8541 Fiches technique(PDF) 13 Page - NXP Semiconductors |
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TDA8541 Fiches technique(HTML) 13 Page - NXP Semiconductors |
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13 / 20 page ![]() 1998 Apr 01 13 Philips Semiconductors Product specification 1 W BTL audio amplifier TDA8541 PACKAGE OUTLINES UNIT A max. A1 A2 A3 bp cD(1) E(2) (1) eHE LLp QZ y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 0.25 DIMENSIONS (inch dimensions are derived from the original mm dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 1.0 0.4 SOT96-1 X w M θ A A1 A2 b p D HE L p Q detail X E Z e c L v M A (A ) 3 A 4 5 pin 1 index 1 8 y 076E03S MS-012AA 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.20 0.19 0.16 0.15 0.050 0.244 0.228 0.028 0.024 0.028 0.012 0.01 0.01 0.041 0.004 0.039 0.016 0 2.5 5 mm scale SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 95-02-04 97-05-22 |
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