TS274CD datasheet(11/15 Pages) STMICROELECTRONICS

No de pièce	TS274CD

Description	HIGH SPEED CMOS QUAD OPERATIONAL AMPLIFIERS

PDF	15 Pages

Scroll/Zoom	100%

Fabricant	STMICROELECTRONICS [STMicroelectronics]

Site Internet	http://www.st.com

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11 / 15 page

TS274

Package mechanical data

11/15

Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

6.1

DIP14 package

DIM.

mm.

inch

MIN.

TYP

MAX.

MIN.

TYP.

MAX.

0.51

0.020

1.39

1.65

0.055

0.065

0.5

0.020

0.25

0.010

0.787

8.5

0.335

2.54

0.100

15.24

0.600

7.1

0.280

5.1

0.201

3.3

0.130

1.27

2.54

0.050

0.100

Plastic DIP-14 MECHANICAL DATA

P001A

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