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TDA8003TS/C1 Fiches technique(PDF) 19 Page - NXP Semiconductors |
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TDA8003TS/C1 Fiches technique(HTML) 19 Page - NXP Semiconductors |
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19 / 24 page ![]() 2000 Apr 20 19 Philips Semiconductors Product specification I2C-bus SIM card interface TDA8003TS PACKAGE OUTLINE UNIT A1 A2 A3 bp cD(1) E(1) (1) eHE LLp QZ y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm 0.21 0.05 1.80 1.65 0.38 0.25 0.20 0.09 8.4 8.0 5.4 5.2 0.65 1.25 7.9 7.6 0.9 0.7 0.8 0.4 8 0 o o 0.13 0.1 0.2 DIMENSIONS (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. 1.03 0.63 SOT340-1 MO-150 95-02-04 99-12-27 X w M θ A A1 A2 b p D HE L p Q detail X E Z e c L v M A (A ) 3 A 112 24 13 0.25 y pin 1 index 0 2.5 5 mm scale SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1 A max. 2.0 |
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