Moteur de recherche de fiches techniques de composants électroniques
  French  ▼
ALLDATASHEET.FR

X  

TDA4887 Fiches technique(PDF) 2 Page - NXP Semiconductors

No de pièce TDA4887
Description  160 MHz bus-controlled monitor video preamplifier
PDF  68 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Fabricant  PHILIPS [NXP Semiconductors]
Site Internet  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

TDA4887 Fiches technique(HTML) 2 Page - NXP Semiconductors

  TDA4887 Datasheet HTML 1Page - NXP Semiconductors TDA4887 Datasheet HTML 2Page - NXP Semiconductors TDA4887 Datasheet HTML 3Page - NXP Semiconductors TDA4887 Datasheet HTML 4Page - NXP Semiconductors TDA4887 Datasheet HTML 5Page - NXP Semiconductors TDA4887 Datasheet HTML 6Page - NXP Semiconductors TDA4887 Datasheet HTML 7Page - NXP Semiconductors TDA4887 Datasheet HTML 8Page - NXP Semiconductors TDA4887 Datasheet HTML 9Page - NXP Semiconductors Next Button
Zoom Inzoom in Zoom Outzoom out
 2 / 68 page
background image
2001 Oct 19
2
Philips Semiconductors
Product specification
160 MHz bus-controlled monitor video
preamplifier
TDA4887PS
CONTENTS
1
FEATURES
2
GENERAL DESCRIPTION
3
ORDERING INFORMATION
4
QUICK REFERENCE DATA
5
BLOCK DIAGRAM
6
PINNING
7
FUNCTIONAL DESCRIPTION
7.1
Signal input stage
7.2
Electronic potentiometer stages
7.3
Output stage
7.4
Pedestal blanking
7.5
Output clamping and feedback references
7.6
Clamping and blanking pulses
7.7
On Screen Display insertion and OSD contrast
7.8
Subcontrast adjustment, contrast modulation
and beam current limiting
7.9
I2C-bus control
7.10
I2C-bus data buffer
8
LIMITING VALUES
9
THERMAL CHARACTERISTICS
10
CHARACTERISTICS
11
I2C-BUS PROTOCOL
12
TEST AND APPLICATION INFORMATION
12.1
Test board
12.2
Application board with monolithic post amplifier
12.3
Building the application board
12.4
Application hints
13
INTERNAL CIRCUITRY
14
PACKAGE OUTLINE
15
SOLDERING
15.1
Introduction to soldering through-hole mount
packages
15.2
Soldering by dipping or by solder wave
15.3
Manual soldering
15.4
Suitability of through-hole mount IC packages
for dipping and wave soldering methods
16
DATA SHEET STATUS
17
DEFINITIONS
18
DISCLAIMERS
19
PURCHASE OF PHILIPS I2C COMPONENTS



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68


Fiches technique Télécharger

Go To PDF Page


Lien URL



ALLDATASHEET vous a-t-il été utile ?  [ DONATE ] 

À propos de Alldatasheet   |   Publicité   |   Contactez-nous   |   Politique de confidentialité   |   Lien vers la fiche technique    |   Echange de liens   |   Fabricants
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com