LX5261 datasheet(2/6 Pages) MICROSEMI

2 / 6 page

Microsemi

Integrated Products Division

11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570

Page 2

Rev. 1.0c, 2005-02-08

LX5261

27-Line LVD SCSI Source/Sink Regulator

PRODUCTION DATASHEET

ABSOLUTE MAXI MUM RATI NGS

Term Power (VTERM) .........................................................................................................6V

Operating Junction Temperature..................................................................................... 150°C

Storage Temperature Range..............................................................................-65°C to 150°C

RoHS / Pb-freePeak Package Solder Reflow Temperature

(40 second maximum exposure) ........................................................................ 260°C (+0, -5)

Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground.

Currents are positive into, negative out of specified terminal.

TH ERM A L DATA

16-Pin SOIC

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θJA

111.8 °C/W

Junction Temperature Calculation: TJ = TA + (PD x θJA).

The θJA numbers are guidelines for the thermal performance of the device/pc-board

system. All of the above assume no ambient airflow. θJA can vary significantly

depending on mounting technique. (See Application Notes Section: Thermal

considerations)

PACKAGE PIN OUT

N/C

116

N/C

VOUT1

VOUT2

VTERM

HSGND

GND

DIFSENS

DP PACKAGE

(Top View)

NC – No Internal Connection

RoHS / Pb-free 100% Matte Tin Lead

Finish

FUNCTIONAL PIN DESCRIPTION

PIN NAME

DESCRIPTION

VOUT1

1.75V Regulated Output. Capable of sourcing/sinking 200mA.

VOUT2

0.75V Regulated Output. Capable of sourcing/sinking 200mA.

VTERM

Power supply pin for terminator. Connect to SCSI bus VTERM. Usually decoupled

by one 4.7µF low-ESR capacitor. It is absolutely necessary to connect this pin to the

decoupling capacitor through a very low impedance (big traces to PCB). Keeping distances

very short from the decoupling capacitors is somewhat layout dependent and some

applications may benefit from high frequency decoupling with 0.1µF capacitors at VTERM

pin.

DIFSENS

1.3V buffered output for DIFSENS signaling.

GND

Regulator ground pin. Connect to ground.

HSGND

Attached to die mounting pad, but not bonded to GND pin. Pins should be considered a

heat sink only, and not a true ground connection. It is recommended that these pins be

connected to ground, but can be left floating.

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