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TDA1572 Fiches technique(PDF) 18 Page - NXP Semiconductors |
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TDA1572 Fiches technique(HTML) 18 Page - NXP Semiconductors |
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18 / 19 page ![]() December 1987 18 Philips Semiconductors Product specification AM receiver circuit TDA1572 PACKAGE OUTLINE REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ SOT102-1 93-10-14 95-01-23 UNIT A max. 12 b1 (1) (1) (1) b2 cD E e M Z H L mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) A min. A max. b max. w ME e 1 1.40 1.14 0.53 0.38 0.32 0.23 21.8 21.4 6.48 6.20 3.9 3.4 0.254 2.54 7.62 8.25 7.80 9.5 8.3 0.85 4.7 0.51 3.7 inches 0.055 0.044 0.021 0.015 0.013 0.009 1.40 1.14 0.055 0.044 0.86 0.84 0.26 0.24 0.15 0.13 0.01 0.10 0.30 0.32 0.31 0.37 0.33 0.033 0.19 0.020 0.15 MH c (e ) 1 ME A L A1 w M b1 b2 e D A2 Z 18 1 10 9 b E pin 1 index 0 5 10 mm scale Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. DIP18: plastic dual in-line package; 18 leads (300 mil) SOT102-1 |
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