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TBA120 Fiches technique(PDF) 8 Page - NXP Semiconductors |
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TBA120 Fiches technique(HTML) 8 Page - NXP Semiconductors |
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8 / 9 page ![]() March 1986 8 Philips Semiconductors Product specification Sound I.F. amplifier/demodulator for TV TBA120U PACKAGE OUTLINE UNIT A max. 1 2 (1) (1) b1 cD (1) Z Ee MH L REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm inches DIMENSIONS (inch dimensions are derived from the original mm dimensions) SOT27-1 92-11-17 95-03-11 A min. A max. b max. w ME e 1 1.73 1.13 0.53 0.38 0.36 0.23 19.50 18.55 6.48 6.20 3.60 3.05 0.254 2.54 7.62 8.25 7.80 10.0 8.3 2.2 4.2 0.51 3.2 0.068 0.044 0.021 0.015 0.77 0.73 0.014 0.009 0.26 0.24 0.14 0.12 0.01 0.10 0.30 0.32 0.31 0.39 0.33 0.087 0.17 0.020 0.13 050G04 MO-001AA MH c (e ) 1 ME A L A1 w M b1 e D A2 Z 14 1 8 7 b E pin 1 index 0 5 10 mm scale Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. DIP14: plastic dual in-line package; 14 leads (300 mil) SOT27-1 |
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