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MPXM2010 Fiches technique(PDF) 4 Page - Freescale Semiconductor, Inc |
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MPXM2010 Fiches technique(HTML) 4 Page - Freescale Semiconductor, Inc |
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4 / 9 page ![]() Sensors 4 Freescale Semiconductor MPXM2010 Figure 2. Linearity Specification Comparison ON-CHIP TEMPERATURE COMPENSATION AND CALIBRATION Figure 3 shows the minimum, maximum and typical output characteristics of the MPXM2010 series at 25 °C. The output is directly proportional to the differential pressure and is essentially a straight line. A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. Figure 3. Output versus Pressure Differential Pressure (% Full Scale) 050 100 End Point Straight Line Fit Least Squares Fit Straight Line Deviation Offset Least Square Deviation Exaggerated Performance Curve Offset (Typical) 30 20 15 10 5 25 0 -5 kPa PSI 2.5 0.362 5 0.725 7.5 1.09 10 1.45 MAX TYP MIN Span Range (Typical) VS = 10 Vdc TA = 25°C |
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