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MPX5010 Fiches technique(PDF) 9 Page - Freescale Semiconductor, Inc

No de pièce MPX5010
Description  Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
PDF  18 Pages
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Fabricant  FREESCALE [Freescale Semiconductor, Inc]
Site Internet  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MPX5010 Fiches technique(HTML) 9 Page - Freescale Semiconductor, Inc

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PACKAGE DIMENSIONS
MPX5010
Sensors
Freescale Semiconductor
9
PIN 1
F
G
N
L
R
12
34
5
6
6 PL
D
SEATING
PLANE
-T-
M
A
M
0.136 (0.005)
T
POSITIVE PRESSURE
(P1)
C
B
M
J
S
-A-
STYLE 1:
PIN 1. VOUT
2. GROUND
3. VCC
4. V1
5. V2
6. VEX
STYLE 3:
PIN 1. OPEN
2. GROUND
3. +VOUT
4. +VSUPPLY
5. -VOUT
6. OPEN
STYLE 2:
PIN 1. OPEN
2. GROUND
3. -VOUT
4. VSUPPLY
5. +VOUT
6. OPEN
MAX
MILLIMETERS
INCHES
16.00
13.56
5.59
0.84
1.63
0.100 BSC
2.54 BSC
0.40
18.42
30˚ NOM
30˚ NOM
12.57
11.43
DIM
A
B
C
D
F
G
J
L
M
N
R
S
MIN
0.595
0.514
0.200
0.027
0.048
0.014
0.695
0.475
0.430
0.090
MAX
0.630
0.534
0.220
0.033
0.064
0.016
0.725
0.495
0.450
0.105
MIN
15.11
13.06
5.08
0.68
1.22
0.36
17.65
12.07
10.92
2.29
2.66
NOTES:
1.
2.
3.
DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
CASE 867-08
ISSUE N
UNIBODY PACKAGE



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