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MPC8323ECVRADDC Fiches technique(PDF) 48 Page - Freescale Semiconductor, Inc |
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MPC8323ECVRADDC Fiches technique(HTML) 48 Page - Freescale Semiconductor, Inc |
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48 / 80 page ![]() MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 0 48 Freescale Semiconductor Package and Pin Listings Notes: 1. All dimensions are in millimeters. 2. Dimensions and tolerances per ASME Y14.5M-1994. 3. Maximum solder ball diameter measured parallel to datum A. 4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls. Figure 42. Mechanical Dimensions and Bottom Surface Nomenclature of the MPC8323E PBGA |
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