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MPC8313E Fiches technique(PDF) 57 Page - Freescale Semiconductor, Inc |
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MPC8313E Fiches technique(HTML) 57 Page - Freescale Semiconductor, Inc |
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57 / 88 page ![]() MPC8313E PowerQUICC™ II Pro Processor Hardware Specifications, Rev. 0 Freescale Semiconductor 57 Package and Pin Listings Figure 38. Mechanical Dimension and Bottom Surface Nomenclature of the MPC8313E TEPBGAII 1. All dimensions are in millimeters. 2. Dimensions and tolerances per ASME Y14.5M-1994. 3. Maximum solder ball diameter measured parallel to datum A. 4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls. 5. Package code 5368 is to account for PGE and the built–in heat spreader. |
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