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PCF8593P Fiches technique(PDF) 24 Page - NXP Semiconductors |
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PCF8593P Fiches technique(HTML) 24 Page - NXP Semiconductors |
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24 / 28 page ![]() 1997 Mar 25 24 Philips Semiconductors Product specification Low power clock/calendar PCF8593 15 PACKAGE OUTLINES REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ SOT97-1 92-11-17 95-02-04 UNIT A max. 12 b1 (1) (1) (1) b2 cD E e M Z H L mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) A min. A max. b max. w ME e 1 1.73 1.14 0.53 0.38 0.36 0.23 9.8 9.2 6.48 6.20 3.60 3.05 0.254 2.54 7.62 8.25 7.80 10.0 8.3 1.15 4.2 0.51 3.2 inches 0.068 0.045 0.021 0.015 0.014 0.009 1.07 0.89 0.042 0.035 0.39 0.36 0.26 0.24 0.14 0.12 0.01 0.10 0.30 0.32 0.31 0.39 0.33 0.045 0.17 0.020 0.13 b2 050G01 MO-001AN MH c (e ) 1 ME A L A1 w M b1 e D A2 Z 8 1 5 4 b E 0 5 10 mm scale Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. pin 1 index DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1 |
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