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PCF8591 Fiches technique(PDF) 22 Page - NXP Semiconductors |
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PCF8591 Fiches technique(HTML) 22 Page - NXP Semiconductors |
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22 / 28 page ![]() 1998 Jul 02 22 Philips Semiconductors Product specification 8-bit A/D and D/A converter PCF8591 16 PACKAGE OUTLINES UNIT A max. 1 2 b1 cE e MH L REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm inches DIMENSIONS (inch dimensions are derived from the original mm dimensions) SOT38-1 92-10-02 95-01-19 A min. A max. b max. w ME e 1 1.40 1.14 0.055 0.045 0.53 0.38 0.32 0.23 21.8 21.4 0.86 0.84 6.48 6.20 0.26 0.24 3.9 3.4 0.15 0.13 0.254 2.54 7.62 0.30 8.25 7.80 0.32 0.31 9.5 8.3 0.37 0.33 2.2 0.087 4.7 0.51 3.7 0.15 0.021 0.015 0.013 0.009 0.01 0.10 0.020 0.19 050G09 MO-001AE MH c (e ) 1 ME A L A1 w M b1 e D A2 Z 16 1 9 8 b E pin 1 index 0 5 10 mm scale Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. (1) (1) D (1) Z DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 |
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