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PCF8583P Fiches technique(PDF) 23 Page - NXP Semiconductors |
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PCF8583P Fiches technique(HTML) 23 Page - NXP Semiconductors |
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23 / 28 page ![]() 1997 Jul 15 23 Philips Semiconductors Product specification Clock/calendar with 240 × 8-bit RAM PCF8583 15 PACKAGE OUTLINES REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ SOT97-1 92-11-17 95-02-04 UNIT A max. 12 b1 (1) (1) (1) b2 cD E e M Z H L mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) A min. A max. b max. w ME e 1 1.73 1.14 0.53 0.38 0.36 0.23 9.8 9.2 6.48 6.20 3.60 3.05 0.254 2.54 7.62 8.25 7.80 10.0 8.3 1.15 4.2 0.51 3.2 inches 0.068 0.045 0.021 0.015 0.014 0.009 1.07 0.89 0.042 0.035 0.39 0.36 0.26 0.24 0.14 0.12 0.01 0.10 0.30 0.32 0.31 0.39 0.33 0.045 0.17 0.020 0.13 b2 050G01 MO-001AN MH c (e ) 1 ME A L A1 w M b1 e D A2 Z 8 1 5 4 b E 0 5 10 mm scale Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. pin 1 index DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1 |
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