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PCF8574P Fiches technique(PDF) 16 Page - NXP Semiconductors |
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PCF8574P Fiches technique(HTML) 16 Page - NXP Semiconductors |
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16 / 24 page ![]() 1997 Apr 02 16 Philips Semiconductors Product specification Remote 8-bit I/O expander for I2C-bus PCF8574 12 PACKAGE OUTLINES UNIT A max. 1 2 b1 cE e MH L REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm inches DIMENSIONS (inch dimensions are derived from the original mm dimensions) SOT38-1 92-10-02 95-01-19 A min. A max. b max. w ME e 1 1.40 1.14 0.055 0.045 0.53 0.38 0.32 0.23 21.8 21.4 0.86 0.84 6.48 6.20 0.26 0.24 3.9 3.4 0.15 0.13 0.254 2.54 7.62 0.30 8.25 7.80 0.32 0.31 9.5 8.3 0.37 0.33 2.2 0.087 4.7 0.51 3.7 0.15 0.021 0.015 0.013 0.009 0.01 0.10 0.020 0.19 050G09 MO-001AE MH c (e ) 1 ME A L A1 w M b1 e D A2 Z 16 1 9 8 b E pin 1 index 0 5 10 mm scale Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. (1) (1) D (1) Z DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 |
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