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PCF85103C-2P Fiches technique(PDF) 13 Page - NXP Semiconductors |
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PCF85103C-2P Fiches technique(HTML) 13 Page - NXP Semiconductors |
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13 / 20 page ![]() Philips Semiconductors PCF85103C-2 256 × 8-bit CMOS EEPROM with I2C-bus interface Product data Rev. 02 — 09 May 2002 13 of 20 9397 750 09646 © Koninklijke Philips Electronics N.V. 2002. All rights reserved. 13. Package outline Fig 10. DIP8 package outline (SOT97-1). REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ SOT97-1 95-02-04 99-12-27 UNIT A max. 12 b1 (1) (1) (1) b2 cD E e M Z H L mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) A min. A max. b max. w M E e 1 1.73 1.14 0.53 0.38 0.36 0.23 9.8 9.2 6.48 6.20 3.60 3.05 0.254 2.54 7.62 8.25 7.80 10.0 8.3 1.15 4.2 0.51 3.2 inches 0.068 0.045 0.021 0.015 0.014 0.009 1.07 0.89 0.042 0.035 0.39 0.36 0.26 0.24 0.14 0.12 0.01 0.10 0.30 0.32 0.31 0.39 0.33 0.045 0.17 0.020 0.13 b2 050G01 MO-001 SC-504-8 MH c (e ) 1 ME A L A1 w M b1 e D A2 Z 8 1 5 4 b E 0 5 10 mm scale Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. pin 1 index DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1 |
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