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PCD3312C Fiches technique(PDF) 22 Page - NXP Semiconductors |
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PCD3312C Fiches technique(HTML) 22 Page - NXP Semiconductors |
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22 / 28 page ![]() 1996 Nov 21 22 Philips Semiconductors Product specification DTMF/modem/musical-tone generators PCD3311C; PCD3312C 13 PACKAGE OUTLINES UNIT A max. 1 2 (1) (1) b1 cD (1) Z Ee MH L REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm inches DIMENSIONS (inch dimensions are derived from the original mm dimensions) SOT27-1 92-11-17 95-03-11 A min. A max. b max. w ME e 1 1.73 1.13 0.53 0.38 0.36 0.23 19.50 18.55 6.48 6.20 3.60 3.05 0.254 2.54 7.62 8.25 7.80 10.0 8.3 2.2 4.2 0.51 3.2 0.068 0.044 0.021 0.015 0.77 0.73 0.014 0.009 0.26 0.24 0.14 0.12 0.01 0.10 0.30 0.32 0.31 0.39 0.33 0.087 0.17 0.020 0.13 050G04 MO-001AA MH c (e ) 1 ME A L A1 w M b1 e D A2 Z 14 1 8 7 b E pin 1 index 0 5 10 mm scale Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. DIP14: plastic dual in-line package; 14 leads (300 mil) SOT27-1 |
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