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PCD3310P Fiches technique(PDF) 21 Page - NXP Semiconductors |
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PCD3310P Fiches technique(HTML) 21 Page - NXP Semiconductors |
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21 / 28 page ![]() 1996 Nov 21 21 Philips Semiconductors Product specification Pulse and DTMF diallers with redial PCD3310; PCD3310A 14 PACKAGE OUTLINES UNIT A max. 1 2 b1 cD E e MH L REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm inches DIMENSIONS (inch dimensions are derived from the original mm dimensions) SOT146-1 92-11-17 95-05-24 A min. A max. b Z max. w M E e 1 1.73 1.30 0.53 0.38 0.36 0.23 26.92 26.54 6.40 6.22 3.60 3.05 0.254 2.54 7.62 8.25 7.80 10.0 8.3 2.0 4.2 0.51 3.2 0.068 0.051 0.021 0.015 0.014 0.009 1.060 1.045 0.25 0.24 0.14 0.12 0.01 0.10 0.30 0.32 0.31 0.39 0.33 0.078 0.17 0.020 0.13 SC603 MH c (e ) 1 ME A L A1 w M b1 e D A2 Z 20 1 11 10 b E pin 1 index 0 5 10 mm scale Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. (1) (1) (1) DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1 |
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