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PCB8517 Fiches technique(PDF) 19 Page - NXP Semiconductors |
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PCB8517 Fiches technique(HTML) 19 Page - NXP Semiconductors |
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19 / 24 page ![]() 1997 Mar 03 19 Philips Semiconductors Objective specification Stand-alone OSD for monitor applications PCB8517 PACKAGE OUTLINE REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ SOT38-4 92-11-17 95-01-14 MH c (e ) 1 ME A L A1 w M b1 b2 e D A2 Z 16 1 9 8 E pin 1 index b 0 5 10 mm scale Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. UNIT A max. 12 b1 (1) (1) (1) b2 cD E e M Z H L mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) A min. A max. b max. w ME e 1 1.73 1.30 0.53 0.38 0.36 0.23 19.50 18.55 6.48 6.20 3.60 3.05 0.254 2.54 7.62 8.25 7.80 10.0 8.3 0.76 4.2 0.51 3.2 inches 0.068 0.051 0.021 0.015 0.014 0.009 1.25 0.85 0.049 0.033 0.77 0.73 0.26 0.24 0.14 0.12 0.01 0.10 0.30 0.32 0.31 0.39 0.33 0.030 0.17 0.020 0.13 DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4 |
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