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STTH6012 Fiches technique(PDF) 6 Page - STMicroelectronics |
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STTH6012 Fiches technique(HTML) 6 Page - STMicroelectronics |
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6 / 8 page ![]() Package information STTH6012 6/8 2 Package information Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.80 Nm Maximum torque value: 1.0 Nm In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 5. DO-247 dimensions REF. DIMENSIONS Millimeters Inches Min. Max Min. Max. A 4.85 5.15 0.191 0.203 D 2.20 2.60 0.086 0.102 E 0.40 0.80 0.015 0.031 F 1.00 1.40 0.039 0.055 F2 2.00 0.078 F3 2.00 2.40 0.078 0.094 G 10.90 0.429 H 15.45 15.75 0.608 0.620 L 19.85 20.15 0.781 0.793 L1 3.70 4.30 0.145 0.169 L2 18.50 0.728 L3 14.20 14.80 0.559 0.582 L4 34.60 1.362 L5 5.50 0.216 M 2.00 3.00 0.078 0.118 V5° 5° V2 60° 60° Dia. 3.55 3.65 0.139 0.143 V H L5 L L3 V2 G F F3 L1 F2 L2 L4 V Dia A D ME |
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