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ISP1122ABD Fiches technique(PDF) 39 Page - NXP Semiconductors |
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ISP1122ABD Fiches technique(HTML) 39 Page - NXP Semiconductors |
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39 / 48 page ![]() Philips Semiconductors ISP1122A USB stand-alone hub Preliminary specification Rev. 01 — 27 March 2000 39 of 48 9397 750 06986 © Philips Electronics N.V. 2000. All rights reserved. 17. Package outline Fig 23. SO32 package outline. UNIT A max. A1 A2 A3 bp cD(1) E (1) eHE LLp QZ y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm inches 2.65 0.10 0.25 0.01 1.4 0.055 0.3 0.1 2.45 2.25 0.49 0.36 0.27 0.18 20.7 20.3 7.6 7.4 1.27 10.65 10.00 1.2 1.0 0.95 0.55 8 0 o o 0.25 0.1 0.004 0.25 DIMENSIONS (inch dimensions are derived from the original mm dimensions) Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.1 0.4 SOT287-1 MO-119 (1) 0.012 0.004 0.096 0.086 0.02 0.01 0.050 0.047 0.039 0.419 0.394 0.30 0.29 0.81 0.80 0.011 0.007 0.037 0.022 0.01 0.01 0.043 0.016 w M bp D HE Z e c v M A X A y 32 17 16 1 θ A A1 A2 L p Q detail X L (A ) 3 E pin 1 index 0 5 10 mm scale SO32: plastic small outline package; 32 leads; body width 7.5 mm SOT287-1 97-05-22 99-12-27 |
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