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LP87745 Fiches technique(PDF) 12 Page - Texas Instruments |
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LP87745 Fiches technique(HTML) 12 Page - Texas Instruments |
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12 / 16 page ![]() EXAMPLE STENCIL DESIGN 4226338/A 10/2020 www.ti.com VQFN-HR - 1 mm max height RXV0028A PLASTIC QUAD FLATPACK-NO LEAD SOLDER PASTE EXAMPLE BASED ON 0.1 mm THICK STENCIL EXPOSED PAD FUSED PAD 5&19: 84% PADS 11, 13, 25 & 27: 86% PADS 12 & 26: 89% SCALE: 16X SYMM SYMM (1.17) (0.76) 4X (0.725) 4X (0.8) 4X (0.85) 4X (1.175) 4X (1.075) 4X (0.825) (R 0.05) TYP 28X (0.5) 2X (2.2875) 2X (2.1125) (0) 2X (2.3625) 2X (1.4875) 2X (2.275) 2X (1.225) 4X (0.25) 4X (0.25) 16X (0.25) 4X (0.25) 4X (0.7325) 8X 0.675 8X 0.25 4X (0.25) 4X (0.85) NOTES: (continued) 5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 1 9 10 14 15 23 24 28 5 19 LP87745 SNVSCH5 – NOVEMBER 2023 www.ti.com 12 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: LP87745 |
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