www.ti.com

PACKAGE OUTLINE

C

.228-.244 TYP

[5.80-6.19]

.069 MAX

[1.75]

2X

.150

[3.81]

.005-.010 TYP

[0.13-0.25]

0 - 8

.004-.010

[0.11-0.25]

.010

[0.25]

.016-.050

[0.41-1.27]

4X (0 -15 )

3X .050

[1.27]

.081-.089

[2.07-2.27]

6X .012-.020

[0.31-0.50]

.075

[1.91]

A

.189-.197

[4.81-5.00]

NOTE 3

B

.150-.157

[3.81-3.98]

NOTE 4

4X (0 -15 )

(.041)

[1.04]

SOIC - 1.75 mm max height

DFQ0007A

SMALL OUTLINE INTEGRATED CIRCUIT

4229018/A 10/2022

NOTES:

1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.

Dimensioning and tolerancing per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed .006 [0.15] per side.

4. This dimension does not include interlead flash.

5. No JEDEC Registration as of September 2022

1

7

.010 [0.25]

C A B

5

4

PIN 1 ID AREA

SEATING PLANE

.004 [0.1] C

SEE DETAIL A

TYPICAL

DETAIL A

SCALE 2.800

www.ti.com

ISOTMP35

SNIS232 – OCTOBER 2023

Copyright © 2023 Texas Instruments Incorporated

Submit Document Feedback

21

Product Folder Links: ISOTMP35