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MCP3002TI/ST Fiches technique(PDF) 20 Page - Microchip Technology |
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MCP3002TI/ST Fiches technique(HTML) 20 Page - Microchip Technology |
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20 / 34 page ![]() MCP3002 DS21294E-page 20 2000-2011 Microchip Technology Inc. 7.0 PACKAGING INFORMATION 7.1 Package Marking Information Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e XXXXXXXX XXXXXNNN YYWW NNN 8-Lead SOIC (3.90 mm) Example 3002I SN 1130 3 8-Lead PDIP (300 mil) Example 8-Lead MSOP (3x3 mm) Example 3002 I/P 256 1130 3 3002I 130256 |
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