WM8718

Production Data

w

PD Rev 4.3 November 2006

31

PACKAGE DIMENSIONS – 24 LEAD QFN

DM045.A

INDEX AREA

(D/2 X E/2)

TOP VIEW

D

E

4

NOTES:

1. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.15 mm AND 0.30 mm FROM TERMINAL TIP.

2. FALLS WITHIN JEDEC, MO-220, VARIATION VGGD-2.

3. ALL DIMENSIONS ARE IN MILLIMETRES.

4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JEDEC 95-1 SPP-002.

5. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS.

6. REFER TO APPLICATIONS NOTE WAN_0118 FOR FURTHER INFORMATION REGARDING PCB FOOTPRINTS AND QFN PACKAGE SOLDERING.

7. DEPENDING ON THE METHOD OF LEAD TERMINATION AT THE EDGE OF THE PACKAGE, PULL BACK (L1) MAY BE PRESENT.

8. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.

A3

G

T

H

W

b

Exposed lead

Half etch tie bar

Dimensions (mm)

Symbols

MIN

NOM

MAX

NOTE

A

A1

A3

0.80

0.90

1.00

0.05

0.02

0

0.20 REF

b

D

D2

E

E2

e

L

0.30

0.18

4.00

2.80

2.70

2.55

0.50 BSC

0.30

0.40

0.50

2

2

4.00

2.80

2.70

2.55

0.10

aaa

bbb

ccc

REF:

0.15

0.10

JEDEC, MO-220, VARIATION VGGD-2.

Tolerances of Form and Position

0.25

H

0.1

0.213

G

T

0.1

W

0.2

DETAIL 1

DETAIL 2

A

6

1

13

18

24

19

12

e

D2

b

7

1

B

C

A

BOTTOM VIEW

C

aaa

2 X

C

aaa

2 X

1

C

A3

SEATING PLANE

DETAIL 2

A1

C

0.08

C

ccc

A

5

SIDE VIEW

L

L1

L1

0.15

0.03

7

EXPOSED

GROUND

PADDLE

6

DETAIL 1

0.32mm

45

degrees

EXPOSED

GROUND

PADDLE

e

Datum

DETAIL 2

Terminal

tip

e/2

R

E2

SEE DETAIL 2