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PUSB3CB4 Fiches technique(PDF) 4 Page - Nexperia B.V. All rights reserved |
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PUSB3CB4 Fiches technique(HTML) 4 Page - Nexperia B.V. All rights reserved |
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4 / 7 page ![]() Nexperia PUSB3CB4 Extremely low capacitance bidirectional ESD protection diode array 9. Soldering SOT1176-2 Footprint information for reflow soldering of DFN2510A-10 package Hx By Hy 0.05 C P D 0.05 Ay Dimensions in mm Ay By C D Hy 1.25 0.3 0.475 0.2 P 0.5 1.5 Hx 2.45 Generic footprint pattern Refer to the package outline drawing for actual layout recommended stencil thickness: 0.1 mm sot1176-2_fr occupied area solder paste solder resist solder land Issue date 21-07-05 Fig. 2. Reflow soldering footprint for DFN2510A-10 (SOT1176-2) PUSB3CB4_SDS All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2023. All rights reserved Short data sheet 8 August 2023 4 / 7 |
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