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PSMN2R8-80SSF Fiches technique(PDF) 7 Page - Nexperia B.V. All rights reserved |
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PSMN2R8-80SSF Fiches technique(HTML) 7 Page - Nexperia B.V. All rights reserved |
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7 / 9 page ![]() Nexperia PSMN2R8-80SSF NextPower 80 V, 2.8 mOhm, 190 Amp, N-channel MOSFET in LFPAK88 package 12. Soldering SOT1235 Footprint information for reflow soldering of LFPAK88 package sot1235_fr Issue date 18-12-12 18-12-13 occupied area 1.25 0.2 0.2 0.1 1.15 1.3 1.4 1.6 1.76 5.7 3.74 9.4 6.55 6.8 7 0.7 4.275 7.8 1.6 1.225 1.9 2.925 1.85 2.05 1.7 1.2 2.1 8.6 0.3 0.2 0.2 0.7 8.8 9.2 solder land solder resist solder paste Dimensions in mm 1.2 1.4 7.8 recommended stencil thickness: 0.125 mm 1.1 2 Fig. 6. Reflow soldering footprint for LFPAK88 (SOT1235) PSMN2R8-80SSF All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2022. All rights reserved Objective data sheet 23 June 2022 7 / 9 |
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