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STG3693 Fiches technique(PDF) 13 Page - STMicroelectronics |
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STG3693 Fiches technique(HTML) 13 Page - STMicroelectronics |
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13 / 17 page ![]() STG3693 Package mechanical data 13/17 Note: 1 VFQFPN - Standard for thermally enhanced vey fine pitch quad flat package no leads. 2 The leads size is comprehensive of the thickness of the leads finishing material. 3 Dimensions do not include mold protusion. 4 Package outline exclusive of metal burrs dimensions. 5 Shipping media tape and reel units: 3000 Figure 12. Foot print recommendation Table 9. QFN16L (2.6x1.8mm) mechanical data Dim. mm. Min Typ Max A 0.45 0.50 0.55 A1 0 0.02 0.05 A3 0.127 b 0.15 0.20 0.25 D 2.50 2.60 2.70 D2 1.40 1.50 1.60 E 1.70 1.80 1.90 E2 0.60 0.70 0.80 e 0.40 L 0.25 0.30 0.35 |
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